99.99% Nickel Sputtering Targets

99.99% Nickel Sputtering Targets Description

The target material is the material used as the source of sputtering or evaporation in the process of physical vapor deposition (PVD) or chemical vapor deposition(CVD), and its purity determines the coating quality. 99.99% Nickel Sputtering Targets are the most common targets used to make thin films for semiconductor devices. They are used to make MRAMs, neural network like devices, thermoelectric materials, solar cells, etc., to improve the conduction rate and service life of electronic devices.
Features of 99.99% Nickel Sputtering Targets
1. Good machinability: It can be easily processed into the desired shape and size through various machining technologies
2. Strong corrosion resistance: it can work stably in harsh environments, such as maintaining stable performance under acidic or alkaline conditions, especially suitable for industrial environments with strong chemical corrosion.
3. High purity: purity is more than 99.99%, which can effectively reduce the introduction of impurities and improve the performance of the final product.
4. Good thermal and electrical conductivity, high strength and good ductility
5. Uniform microstructure, specific electrical and magnetic properties, long service life

99.99% Nickel Sputtering Targets Specifications:

99.99% Nickel Sputtering Targets Picture

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